Ball Grid Array package having integrated antenna pad

Communications: radio wave antennas – Antennas – With radio cabinet

Reexamination Certificate

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C343S7000MS, C343S895000, C257S734000

Reexamination Certificate

active

07369090

ABSTRACT:
An apparatus for an improved Ball Grid Array (BGA) package includes a semiconductor device having a radio frequency (RF) input or output, an antenna pad, and a BGA package structured to house the semiconductor device and the antenna pad. The antenna pad may be coupled to the radio frequency (RF) input or output, and the antenna pad is structured to reduce the inductance of the BGA package. The antenna pad may include a pad disposed above the semiconductor device, a pad disposed to the side of the semiconductor device, or an antenna chip. An antenna may be coupled to the antenna pad. The antenna may include a trace antenna, a staggered antenna, or a helical antenna.

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patent: WO 2004/042868 (2004-05-01), None

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