Ball grid array package emulator

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

Patent

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Details

324765, G01R 3102

Patent

active

060694823

ABSTRACT:
An adapter is described herein which releasably connects a ball grid array package to a printed circuit board, or to a testing board, such that the ball grid array package may be reused. In a preferred embodiment, an inexpensive base of the adapter contains solder balls or terminals on its bottom surface in the same pattern as the solder balls on the bottom of the ball grid array package. The terminals protrude slightly through the top surface of the base. A conductive elastomer, which conducts in one direction only, is then placed over the top surface of the base of the adapter so as to make electrical contact with the protruding terminals on the base. A ball grid array package is then placed over the conductive elastomer such that the solder balls on the bottom surface of the ball grid array package electrically contact respective terminals on the base. To releasably secure the ball grid array package in place, a lid is placed over the adapter and secured to the base of the adapter with screws or a latching mechanism. If it is desired to provide external access to the leads of the ball grid array package or to the terminals on the printed circuit board, a test probe board, having conductive pads leading to test pins, is contained in the adapter.

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