Ball grid array module

Compositions – Preservative agents – Anti-caking – separative or protective coatings or zones

Reexamination Certificate

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Details

C252S382000, C252S384000, C252S400620, C252S06230Q, C252S001000, C510S403000, C510S404000, C510S434000, C029S854000, C029S832000, C257SE21506, C427S468000

Reexamination Certificate

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06994803

ABSTRACT:
The method according to a preferred embodiment of the present invention mitigates the problem of gold contamination during the SMT assembly operations in the manufacture of Hybrid Multi Chip Modules (HMCM), achieving a high assembly process yield. This target is accomplished by protecting, at the first process step, the gold with a thin layer (0.02–0.03 millimeter) of a paste very soluble in water and washing it off.The protective layer obtained with the above described method is very strong. Furthermore it is very easy to remove, since it is soluble in water.

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patent: 2405861 (1946-08-01), Tod
patent: 5374417 (1994-12-01), Norfleet et al.
patent: 5676956 (1997-10-01), Duffy et al.
patent: 5683712 (1997-11-01), Cavazza
patent: 5718931 (1998-02-01), Walter et al.
patent: 5976521 (1999-11-01), Briggs et al.
patent: 6207139 (2001-03-01), Lee et al.
patent: 2005/0001017 (2005-01-01), Oggioni

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