Image analysis – Applications – Manufacturing or product inspection
Reexamination Certificate
2007-05-15
2007-05-15
Mariam, Daniel (Department: 2624)
Image analysis
Applications
Manufacturing or product inspection
Reexamination Certificate
active
10379308
ABSTRACT:
A computer-implemented method for inspecting BGA components using a ball grid array model thereof in semiconductor surface mounted devices. The method comprises setting a plurality of regions of interest (ROIs) for all BGA balls to be modeled, building a first grid model that includes coordinates and a diameter of the BGA balls in the plurality of ROIs, setting a plurality of regions of interest (ROIs) containing a BGA body to be modeled, detecting four body boundaries to localize four corner coordinates, determining a body orientation from orientations of four boundaries, calculating an orientation of each boundary by the projection of the edge of boundary, and comparing the BGA components with an obtained BGA model to inspect the BGA components based on ball sizes and ball distributions.
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Cognex Corp. “BGA II Inspection Package”, pp. 1-4, 2001.
Yu, et al. “New Approach To Vision-Based BGA Package Inspection”, IEEE, pp. 107-1110, Nov. 2002.
Fang Ming
Fang Tong
F. Chau & Associates LLC
Mariam Daniel
Paschburg Donald B.
Siemens Corporate Research Inc.
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