Ball grid array integrated circuit package with high thermal con

Details Ball grid array integrated circuit package with high thermal con Ball grid array integrated circuit package with high thermal con

1994-04-08

1999-11-23

Thompson, Gregory

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174 163, 257713, 361719, H05K 720

Patent

active

059911565

ABSTRACT:
An integrated circuit package with a path of high thermal conductivity is disclosed. A thermally conductive slug, formed of a material such as copper, is attached to an underside portion of a substrate, such as a printed circuit board or a ceramic substrate, through which an opening has been formed. An integrated circuit chip is mounted to one side of the slug exposed in the opening. An opposing surface of the slug lies below the plane of the underside of the substrate. The chip is wire bonded to the substrate, and is encapsulated in the conventional manner. Solder balls are attached to a portion of the underside of the substrate not covered by the slug in a ball-grid-array manner, for mounting to a circuit board. Upon mounting to the circuit board, a path of high thermal conductivity is provided between the chip and the circuit board, through the slug and the solder balls.

REFERENCES:
patent: 5157480 (1992-10-01), McShane et al.
patent: 5172301 (1992-12-01), Schneider
patent: 5222014 (1993-06-01), Lin
patent: 5285352 (1994-02-01), Pasture et al.
patent: 5291062 (1994-03-01), Higgins, III
patent: 5311402 (1994-05-01), Kobayashi et al.

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