Ball grid array integrated circuit package with high thermal con

Details Ball grid array integrated circuit package with high thermal con Ball grid array integrated circuit package with high thermal con

1996-01-18

1997-12-02

Picardat, Kevin

Fishing, trapping, and vermin destroying

437211, 437214, 437217, 437219, 437902, H01L 2160

Patent

active

056935722

ABSTRACT:
An integrated circuit package with a path of high thermal conductivity is disclosed. A thermally conductive slug, formed of a material such as copper, is attached to an underside portion of a substrate, such as a printed circuit board or a ceramic substrate, through which an opening has been formed. An integrated circuit chip is mounted to one side of the slug exposed in the opening. An opposing surface of the slug lies below the plane of the underside of the substrate. The chip is wire bonded to the substrate, and is encapsulated in the conventional manner. Solder balls are attached to a portion of the underside of the substrate not covered by the slug in a ball-grid-array manner, for mounting to a circuit board. Upon mounting to the circuit board, a path of high thermal conductivity is provided between the chip and the circuit board, through the slug and the solder balls.

REFERENCES:
patent: 5012386 (1991-04-01), McShane et al.
patent: 5041396 (1991-08-01), Valero
patent: 5081067 (1992-01-01), Shimizu et al.
patent: 5102829 (1992-04-01), Cohn
patent: 5120678 (1992-06-01), Moore et al.
patent: 5157480 (1992-10-01), McShane et al.
patent: 5172301 (1992-12-01), Schneider
patent: 5202288 (1993-04-01), Doering et al.
patent: 5216278 (1993-06-01), Lin et al.
patent: 5222014 (1993-06-01), Lin
patent: 5266834 (1993-11-01), Nishi et al.
patent: 5285352 (1994-02-01), Pastore et al.
patent: 5291062 (1994-03-01), Higgins, III
patent: 5311402 (1994-05-01), Kobayashi et al.
patent: 5362679 (1994-11-01), Wakefield
patent: 5403776 (1995-04-01), Tsuji et al.
patent: 5438478 (1995-08-01), Kondo et al.
patent: 5444025 (1995-08-01), Sono et al.
patent: 5455456 (1995-10-01), Newman
patent: 5474958 (1995-12-01), Djennas et al.

Affiliated with

Also associated with

Rating

Ball grid array integrated circuit package with high thermal con does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Ball grid array integrated circuit package with high thermal con, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Ball grid array integrated circuit package with high thermal con will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-801050