Ball grid array including modified hard ball contacts and appara

Details Ball grid array including modified hard ball contacts and appara Ball grid array including modified hard ball contacts and appara

1996-08-08

1998-02-10

Abrams, Neil

Electrical connectors

Including elastomeric or nonmetallic conductive portion

Adapted to be sandwiched between preformed panel circuit...

174260, 361771, 361772, H01R 458

Patent

active

057162220

ABSTRACT:
A plurality of rigid, generally spherical contact elements are attached to the solder balls of a ball grid array (BGA) package to provide rigid contact points that are suitable for engagement with the contacts of a direct BGA socket assembly. The contact elements include a flattened circumferential surface and a circumferential groove formed in the flattened surface. The circumferential groove divides the contact element into opposing hemispheres. An alignment assembly for aligning the contact elements with the BGA solder ball footprint includes a carrier sheet of electrically insulative, flexible material having a plurality of holes arranged in a predetermined array corresponding to the footprint of solder balls. The contact elements are snap received within the holes of the carrier sheet such that one hemisphere of the contact element is disposed on each side of the carrier sheet. The alignment assembly further includes an alignment fixture for receiving the carrier sheet and BGA package in overlying relation. The alignment fixture includes alignment pins for aligning the carrier sheet in a predetermined position, and alignment arms for aligning the BGA package relative to the carrier sheet. In a method for attaching the contact elements to the solder balls, the solder balls are heated to a reflow temperature wherein gravity forces BGA package downwardly onto the contact element and the facing hemisphere of the contacts are attached to the solder ball while the opposing hemisphere remains exposed for engagement with the socket contact.

REFERENCES:
patent: 3971610 (1976-07-01), Butchoff et al.
patent: 5477933 (1995-12-01), Nguyen
patent: 5483421 (1996-01-01), Gedney et al.
patent: 5491303 (1996-02-01), Weiss
patent: 5531021 (1996-07-01), Kolman et al.

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