Ball grid array electronic package standoff design

Details Ball grid array electronic package standoff design Ball grid array electronic package standoff design

1996-02-14

1998-09-08

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361761, 361764, 361772, 361809, 257704, 257737, 257738, 257780, 257786, 438122, 438124, 438613, 22818022, H05K 118, H05K 334

Patent

active

058054278

ABSTRACT:
A surface mount package to encapsulate one or more semiconductor devices has a standoff that maintains the thickness of solder columns bonding the package to an external circuit. The standoff either extends over or circumscribes a central portion of the package base. To enhance the thermal performance of the standoff, a solderable layer enhances soldering of the standoff to the external circuit.
In alternative embodiments, the standoff contains a flange having a plurality of apertures useful for either mechanically locking an adhesive or for enabling irradiation of an adhesive by a light source. The standoff may contain protrusions for alignment, strength or circuit routing.

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