Ball grid array connector

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – Distinct contact secured to panel circuit

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

439 71, H01R 402

Patent

active

05997317&

ABSTRACT:
A ball grid array connector comprises an insulative housing having a mating face and a soldering face opposite to the mating face and a plurality of passageways defined between the mating face and the soldering face. A plurality of contacts are received in the passageways and each contact comprises a contacting portion and a soldering portion substantially perpendicular to the soldering portion. A solder ball is attached to the soldering portion of each contact and the solder ball has a diameter less than a width of the soldering portion of the contact.

REFERENCES:
patent: 5475317 (1995-12-01), Smith
patent: 5591941 (1997-01-01), Acocella et al.
patent: 5593322 (1997-01-01), Swamy et al.
patent: 5691041 (1997-11-01), Frankeny et al.
patent: 5895281 (1999-04-01), Rothenberger

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Ball grid array connector does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Ball grid array connector, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Ball grid array connector will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-817526

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.