Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – Distinct contact secured to panel circuit
Patent
1999-06-21
1999-12-07
Paumen, Gary F.
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
Distinct contact secured to panel circuit
439 71, H01R 402
Patent
active
05997317&
ABSTRACT:
A ball grid array connector comprises an insulative housing having a mating face and a soldering face opposite to the mating face and a plurality of passageways defined between the mating face and the soldering face. A plurality of contacts are received in the passageways and each contact comprises a contacting portion and a soldering portion substantially perpendicular to the soldering portion. A solder ball is attached to the soldering portion of each contact and the solder ball has a diameter less than a width of the soldering portion of the contact.
REFERENCES:
patent: 5475317 (1995-12-01), Smith
patent: 5591941 (1997-01-01), Acocella et al.
patent: 5593322 (1997-01-01), Swamy et al.
patent: 5691041 (1997-11-01), Frankeny et al.
patent: 5895281 (1999-04-01), Rothenberger
Pei Wen-Chun
Szu Ming-Lun
Chung Wei Te
Hon Hai - Precision Ind. Co., Ltd.
Paumen Gary F.
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