Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Reexamination Certificate
2011-07-12
2011-07-12
Sandvik, Benjamin P (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Ball or nail head type contact, lead, or bond
C257S713000, C257SE23023
Reexamination Certificate
active
07977804
ABSTRACT:
A ball-bump bonded ribbon-wire interconnect has a ball-bump attached to an integrated circuit's bond pad. A ribbon-wire has one end attached to the ball-bump and its opposing end attached to a substrate's metallized surface. The ribbon-wire may be wider than the ball-bump, and the ball-bump may separate the ribbon-wire from the integrated circuit's surface. The ribbon-wire may interconnect multiple integrated circuits, each of which has a ball-bump or a suitably wide metallized surface, to a substrate's metallized surface. The present invention also includes a method of electrically connecting an electronic component to a substrate.
REFERENCES:
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patent: 6500760 (2002-12-01), Peterson et al.
patent: 7132738 (2006-11-01), Tomimatsu
patent: 2005/0200015 (2005-09-01), Obiya
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patent: 2001237263 (2001-08-01), None
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patent: 2006/018671 (2006-02-01), None
Harman, George G., “Wire Bonding in Microelectronics Materials, Processes, Reliability, and Yield 2ed”, 1997, McGraw-Hill, USA, XP-002539702, ISBN 0-07-032619-3, pp. 30-32.
Christensen Dale E.
Miller Curtis J.
Langlotz Patent Works Inc.
Lenihan Thomas F.
Sandvik Benjamin P
Soderholm Krista
Tektronix Inc.
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