Metal fusion bonding – Including means to apply flux or filler to work or applicator – Solid flux or solid filler
Reexamination Certificate
2007-05-10
2009-06-16
Gilliam, Barbara L (Department: 4191)
Metal fusion bonding
Including means to apply flux or filler to work or applicator
Solid flux or solid filler
C228S033000, C228S045000, C228S180220, C228S245000, C228S246000, C438S613000, C438S614000, C257S737000, C257S738000
Reexamination Certificate
active
07546941
ABSTRACT:
A ball attaching apparatus for respectively attaching solder balls onto a plurality of ball lands of a material which has mold caps formed between the ball lands. The apparatus includes an indexer on which the material is seated and fixed; a holder located above the indexer such that it can be raised and lowered; an attachment plate installed on a lower surface of the holder, having projections at positions corresponding to the mold caps of the material, and defined with grooves at positions corresponding to the ball lands of the material, in which the solder balls are placed; and eject pins arranged in the respective grooves of the attachment plate for conveying and dropping the solder balls through introduction and removal of vacuum.
REFERENCES:
patent: 6068175 (2000-05-01), Heim et al.
patent: 19990003763 (1999-01-01), None
patent: 1020020075521 (2002-10-01), None
patent: 1020040092064 (2004-11-01), None
patent: 1020050011421 (2005-01-01), None
patent: 1020050012585 (2005-02-01), None
Korean Notice of Patent Grant dated Feb. 27, 2008 for the corresponding application KR 10-2007-0025740.
Go Sang Nam
Kim Hee Sung
Kim Tae Hyung
No Hai Ju
Woo Jung Bum
Gilliam Barbara L
Hynix / Semiconductor Inc.
Ladas & Parry LLP
Mekhlin Eli
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