Gear cutting – milling – or planing – Milling – With means to dampen vibration
Patent
1986-04-04
1987-12-08
Bilinsky, Z. R.
Gear cutting, milling, or planing
Milling
With means to dampen vibration
51235, 74573R, 269 21, 279 3, B23Q 300
Patent
active
047116102
ABSTRACT:
A balancing chuck is disclosed for semiconductor wafers having a flat region which typically causes wafer imbalance on spinning equipment. The wafer's flat region is determined by a proximity sensor mounted on a centering arm overlying the wafer. The chuck is constructed to include an annular race containing a spherical counterweight. As the chuck is rotated to determine the wafer's flat region, a magnet prevents movement of the spherical counterweight within the race and allows for its subsequent alignment with the mass imbalance. A plurality of circumferential pockets are provided within the race to retain the position of the counterweight which functions as a counterbalance maintained in proper angular alignment during spinning of the chuck.
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patent: 4433592 (1984-02-01), Tatsumi et al.
patent: 4597569 (1986-07-01), Itanoto et al.
Bilinsky Z. R.
Machine Technology, Inc.
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