Balancing chuck

Gear cutting – milling – or planing – Milling – With means to dampen vibration

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

51235, 74573R, 269 21, 279 3, B23Q 300

Patent

active

047116102

ABSTRACT:
A balancing chuck is disclosed for semiconductor wafers having a flat region which typically causes wafer imbalance on spinning equipment. The wafer's flat region is determined by a proximity sensor mounted on a centering arm overlying the wafer. The chuck is constructed to include an annular race containing a spherical counterweight. As the chuck is rotated to determine the wafer's flat region, a magnet prevents movement of the spherical counterweight within the race and allows for its subsequent alignment with the mass imbalance. A plurality of circumferential pockets are provided within the race to retain the position of the counterweight which functions as a counterbalance maintained in proper angular alignment during spinning of the chuck.

REFERENCES:
patent: 209475 (1978-10-01), Harris
patent: 2861471 (1956-08-01), Kronenberg
patent: 3410154 (1967-09-01), Deakin
patent: 3733923 (1973-05-01), Goodrich et al.
patent: 3799619 (1974-03-01), LaBarber
patent: 3809050 (1974-05-01), Chough et al.
patent: 3970260 (1976-07-01), Bruggisser et al.
patent: 4060009 (1977-11-01), Wyman
patent: 4075909 (1978-02-01), Deakin
patent: 4433592 (1984-02-01), Tatsumi et al.
patent: 4597569 (1986-07-01), Itanoto et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Balancing chuck does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Balancing chuck, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Balancing chuck will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-21117

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.