Baking apparatus and baking method

Electric heating – Heating devices – Combined with container – enclosure – or support for material...

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219444, F27B 906

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active

06002108&

ABSTRACT:
The baking apparatus of the present invention comprises a casing surrounding a substrate W having a pattern-exposed resist film, a hot plate for heating the substrate in the casing, gas supply mechanisms for supplying a H.sub.2 O component containing humidity gas into the casing. The H.sub.2 O component included in the humidity gas is allowed to react with the resist film by introducing the humidity gas into the casing while the substrate is being heated by the hot plate, thereby rendering either an irradiate portion or a non-irradiate portion of the resist film, soluble in alkali.

REFERENCES:
patent: 4518848 (1985-05-01), Weber
patent: 4800251 (1989-01-01), Matsuoka
patent: 5143552 (1992-09-01), Moriyama
patent: 5227281 (1993-07-01), Gaschler et al.
patent: 5429910 (1995-07-01), Hanawa
patent: 5626782 (1997-05-01), Maeda
patent: 5664254 (1997-09-01), Ohkura et al.
patent: 5817178 (1998-10-01), Mita et al.
patent: 5849582 (1998-12-01), Chen et al.
Patent Abstracts of Japan, vol. 97, No. 6, Jun. 30, 1997, JP 9-043855, Feb. 14, 1997.

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