Baffles for high capacity air-cooling systems for...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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C361S694000, C062S259200, C415S176000

Reexamination Certificate

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07079388

ABSTRACT:
An improved air-cooling system for high performance, high density electronic equipment comprises, in one embodiment, a single fan having a radial impeller, a baffle having an inlet portion to efficiently direct air into the fan intake, and a two-tiered outlet plenum to direct one airflow specifically at the highest heat-generating components and another airflow at all components. The air-cooling system is designed to provide maximum cooling for a low-height, high heat-generating electronics module such as a server. By using only a single fan that is matched to the low resistance airflow characteristics of the baffle, the air-cooling system offers significant advantages over multi-fan systems. Also described are a computer server and methods of making heat-dissipation equipment.

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patent: 5640046 (1997-06-01), Suzuki et al.
patent: 6198628 (2001-03-01), Smith
patent: 6462948 (2002-10-01), Leija et al.
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patent: 2002/0040642 (2002-04-01), Pillion et al.
patent: 2002/0073949 (2002-06-01), Watanabe et al.
patent: 2003/0085476 (2003-05-01), Kinney et al.
patent: 2004/0046038 (2004-03-01), Knowles

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