Backside of chip implementation of redundancy fuses and...

Static information storage and retrieval – Interconnection arrangements

Reexamination Certificate

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C051S295000

Reexamination Certificate

active

06947306

ABSTRACT:
A device having redundant circuit elements is provided with programmable fuse elements on the back surface of the chip. Openings are etched through the chip and connect the circuit elements on the front surface to the fuse elements on the back surface. The fuse elements may be arranged in a grid of lines that are connected to the openings and are read by sequentially activating the lines to activate either a row of fuse elements or a column of fuse elements. Alternatively, bonding pads are provided on the back surface of a chip and are connected to the circuit elements on the front surface of the chip through the openings in the chip.

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