Backside laser dicing system

Details Backside laser dicing system Backside laser dicing system

1974-11-25

1976-07-20

Truhe, J. V.

Electric heating

Metal heating

By arc

29576T, 29583, B23K 2600

Patent

active

039708195

ABSTRACT:
A wafer of semiconductor material having a plurality of units defined on its face is subdivided by treating the wafer, on its back or reverse side, in the kerf regions between the units, where division of the units is desired, such that the material of the wafer in the treated kerf regions is converted to a material having a breaking strength lower than the breaking strength of the semiconductor material.

REFERENCES:
patent: 3112850 (1963-12-01), Garibotti
patent: 3453097 (1969-07-01), Hafner
patent: 3610871 (1971-10-01), Lumley
patent: 3695498 (1972-10-01), Dear
patent: 3790744 (1974-02-01), Bowen
patent: 3800991 (1974-04-01), Grove et al.
patent: 3816700 (1974-06-01), Weiner et al.
patent: 3824678 (1974-07-01), Harris et al.
"Lasers in Industry," by Gagliano et al., Proceedings of the IEEE, vol. 57, No. 2 Feb. 1969, pp. 133-134.

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