Backside deposition for relieving stress and decreasing...

Optical waveguides – Integrated optical circuit

Reexamination Certificate

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C385S129000, C385S131000, C438S031000

Reexamination Certificate

active

06865308

ABSTRACT:
For those optical waveguides that require the deposition of a thick film and a high-temperature anneal to create an appropriate waveguide medium, wafer warping, bowing or dishing is reduced or eliminated by depositing a film of the same thickness on the backside of the wafer so as to relieve film stress during the deposition and annealing process. In one embodiment the waveguide medium is silicon oxynitride, although other depositable thick films may be utilized in place of the silicon oxynitride.

REFERENCES:
patent: 6477308 (2002-11-01), Hattori et al.
patent: 6501896 (2002-12-01), Nara et al.
patent: 20010041039 (2001-11-01), Hattori et al.
patent: 20020064360 (2002-05-01), Makikawa
patent: 20030021567 (2003-01-01), Yoneda
patent: 20030091263 (2003-05-01), Yoneda
patent: 20030095776 (2003-05-01), Saito et al.

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