Backside alignment and packaging of opto-electronic devices

Details Backside alignment and packaging of opto-electronic devices Backside alignment and packaging of opto-electronic devices

2005-01-04

2005-01-04

Pyo, Kevin (Department: 2878)

Radiant energy

Photocells; circuits and apparatus

With circuit for evaluating a web, strand, strip, or sheet

C250S239000, C385S092000, C385S093000, C257S797000

Reexamination Certificate

active

06838689

ABSTRACT:
A die having at least one opto-electronic device disposed on a front-side of the die has its backside mounted to a submount with the backside positioned to align the front-side opto-electronic devices with respect to the submount. A first set of alignment features are formed on the backside of the die which are aligned to the front-side. The first set of a alignment features is then aligned to a second set of alignment features disposed on the submount and the backside is bounded into place.

REFERENCES:
patent: 5796714 (1998-08-01), Chino et al.
patent: 5821532 (1998-10-01), Beaman et al.
patent: 5998878 (1999-12-01), Johnson
patent: 6056448 (2000-05-01), Sauter et al.
patent: 6118917 (2000-09-01), Lee et al.
patent: 6249627 (2001-06-01), Bond et al.
patent: 6295307 (2001-09-01), Hoden et al.

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