Backplane with power plane having a digital ground structure...

Details Backplane with power plane having a digital ground structure... Backplane with power plane having a digital ground structure...

2007-06-01

2008-07-29

Reichard, Dean A. (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C174S255000

Reexamination Certificate

active

07405947

ABSTRACT:
For electrical backplanes and the like, a power plane adaptation to improve the propagation of high-speed signals through clearances in an embedded power plane is disclosed. In exemplary embodiments, the power plane is segmented in a high-speed connector region, such that a portion of the metal layer that forms the power plane is retained in the high-speed connector region—but isolated from the power-delivery portion of the power plane. The isolated portion is connected to digital ground, and clearances are formed therein where high-speed signaling throughholes will pass through the region. In some embodiments, various attainable advantages include better manufacturability, better matching and control of high-speed signaling throughhole impedance, and improved noise isolation. Other embodiments are described and claimed.

REFERENCES:
patent: 4942400 (1990-07-01), Tarzaiski et al.
patent: 5748173 (1998-05-01), Gur
patent: 6229095 (2001-05-01), Kobayashi
patent: 2006/0198113 (2006-09-01), Lambert et al.
patent: 2006/0232949 (2006-10-01), Osaka

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