Backplane system having high-density electrical connectors

Electrical computers and digital processing systems: processing – Processing architecture – Microprocessor or multichip or multimodule processor having...

Reexamination Certificate

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C710S120000, C361S788000, C439S660000

Reexamination Certificate

active

07103753

ABSTRACT:
A computer system architecture in which functionally compatible electronic components are located on modular printed circuit boards. Thus, a type of processor used by the system can be changed by replacing the printed circuit board incorporating the processor. Similarly a type of peripheral bus used can be changed simply by replacing the printed circuit board containing the peripheral controller. High-density connectors connect the circuit boards. Some embodiments of the invention use a single backplane. Other embodiments place peripheral slots on a second, passive backplane.

REFERENCES:
patent: 3337838 (1967-08-01), Damiano
patent: 3366915 (1968-01-01), Miller
patent: 3444506 (1969-05-01), Wedekind
patent: 3848221 (1974-11-01), Lee, Jr.
patent: 4232924 (1980-11-01), Kline et al.
patent: 4274700 (1981-06-01), Keglewitsch et al.
patent: 4487463 (1984-12-01), Tillotson
patent: 4572604 (1986-02-01), Ammon et al.
patent: 4616406 (1986-10-01), Brown
patent: 4654472 (1987-03-01), Goldfarb
patent: 4655526 (1987-04-01), Shaffer
patent: 4663729 (1987-05-01), Matick et al.
patent: 4697858 (1987-10-01), Balakrishnan
patent: 4698663 (1987-10-01), Sugimoto et al.
patent: 4700274 (1987-10-01), Laut
patent: 4734042 (1988-03-01), Martens et al.
patent: 4860088 (1989-08-01), Smith et al.
patent: 4871324 (1989-10-01), Brune et al.
patent: 4876664 (1989-10-01), Bittorf et al.
patent: 4881901 (1989-11-01), Mendenhall et al.
patent: 4897055 (1990-01-01), Jurista et al.
patent: 4932902 (1990-06-01), Crane, Jr.
patent: 4943846 (1990-07-01), Shirling
patent: 4959750 (1990-09-01), Cnyrim et al.
patent: 4975066 (1990-12-01), Sucheski et al.
patent: 4979075 (1990-12-01), Murphy
patent: 4997376 (1991-03-01), Buck et al.
patent: 5015207 (1991-05-01), Koepke
patent: 5036379 (1991-07-01), Smith et al.
patent: 5037311 (1991-08-01), Frankeny et al.
patent: 5041003 (1991-08-01), Smith et al.
patent: 5052936 (1991-10-01), Biechler et al.
patent: 5065141 (1991-11-01), Whitsitt
patent: 5071363 (1991-12-01), Reylek et al.
patent: 5073864 (1991-12-01), Methvin et al.
patent: 5081563 (1992-01-01), Feng et al.
patent: 5101553 (1992-04-01), Carey et al.
patent: 5102342 (1992-04-01), Marian
patent: 5117069 (1992-05-01), Higgins, III
patent: 5119498 (1992-06-01), McNeill et al.
patent: 5123164 (1992-06-01), Shaheen et al.
patent: 5137456 (1992-08-01), Desai et al.
patent: 5162979 (1992-11-01), Anzelone et al.
patent: 5167511 (1992-12-01), Krajewski et al.
patent: 5192220 (1993-03-01), Billman et al.
patent: 5205739 (1993-04-01), Malo et al.
patent: 5227957 (1993-07-01), Deters
patent: 5281151 (1994-01-01), Arima et al.
patent: 5301281 (1994-04-01), Kennedy
patent: 5309024 (1994-05-01), Hirano
patent: 5317697 (1994-05-01), Husak et al.
patent: 5326936 (1994-07-01), Taniuchi et al.
patent: 5330372 (1994-07-01), Pope et al.
patent: 5334279 (1994-08-01), Gregoire
patent: 5342999 (1994-08-01), Frei et al.
patent: 5349343 (1994-09-01), Oliver
patent: 5351393 (1994-10-01), Gregoire
patent: 5355453 (1994-10-01), Row et al.
patent: 5357624 (1994-10-01), Lavan
patent: 5371404 (1994-12-01), Juskey et al.
patent: 5371866 (1994-12-01), Cady
patent: 5376825 (1994-12-01), Tukamoto et al.
patent: 5383787 (1995-01-01), Switky et al.
patent: 5384692 (1995-01-01), Jaff
patent: 5390412 (1995-02-01), Gregoire
patent: 5428750 (1995-06-01), Hsieh et al.
patent: 5432682 (1995-07-01), Giehl et al.
patent: 5461723 (1995-10-01), Shah et al.
patent: 5499341 (1996-03-01), Wilson et al.
patent: 5572685 (1996-11-01), Fisher et al.
patent: 5575688 (1996-11-01), Crane, Jr.
patent: 5617546 (1997-04-01), Shih et al.
patent: 5625780 (1997-04-01), Hsieh et al.
patent: 5625802 (1997-04-01), Cho et al.
patent: 5630163 (1997-05-01), Fung et al.
patent: 5649100 (1997-07-01), Ertel et al.
patent: 5667884 (1997-09-01), Bolger
patent: 5812797 (1998-09-01), Crane et al.
patent: 5822551 (1998-10-01), Crane, Jr. et al.
patent: 6073229 (2000-06-01), Crane, Jr. et al.
patent: 6092139 (2000-07-01), Crane et al.
patent: 6574726 (2003-06-01), Crane, Jr.
patent: 3737819 (1988-05-01), None
patent: 0 237 193 (1987-11-01), None
patent: 0 321 212 (1989-06-01), None
patent: 0 400 930 (1990-12-01), None
patent: 0 405 454 (1991-01-01), None
patent: 0 467 698 (1992-01-01), None
patent: 0 509 765 (1992-10-01), None
patent: 0 526 726 (1993-02-01), None
patent: 0 574 133 (1993-12-01), None
patent: 2 513 477 (1983-03-01), None
patent: 1129608 (1968-10-01), None
patent: 1991-0008536 (1991-05-01), None
patent: 1993-10729 (1993-06-01), None
patent: WO 94/13034 (1994-06-01), None
patent: WO 94/27345 (1994-11-01), None
M.J. Doughterty, “A Sem-E Module Avionics Computer with PI-Bus Backplane Communication”, Institute of Electrical and Electronics Engineers, May 21-25, 1990, pp. 169-173.
D. Eidsmore, “MC68000 and Z80A Share Multiprocesor Bus in S-100 SBC Line”, Computer Design, Jun. 1982, Winchester, Massachusetts, vol. 21, No. 6, pp. 38-40.
Y. Belopolsky, “Interaction of Multichip Module Substrates with High-density Connectors” of IEEE Micro, Apr. 1993, vol. 13, No. 2, ISSN 0272-1732, pp. 36-44.
C. Van Veen, “LRU Servicing Practice Impacts Interconnection”, Electronic Product Design, Jun. 1992, UK., vol. 13, No. 6, ISSN 0263-1474, pp. 45-47.
E. Baker and J. Shakib, “Input/Output Cards for Device Attachements”, IBM Technical Disclosure Bulletin, vol. 27, No. 4b, Sep. 1984, New York, pp. 2406-2407.
M. Ernstberger et al., “The High Density Backplane Interconnect System”, Connection Technology, Aug. 1991, vol. 7, No. 8, ISSN 8756-4076, pp. 19-21.
Readout, “Board Level Options for RISC processors”, Electronic Engineering 61, Mar. 1989, No. 747, Woolwich, London, GB, pp. 71-72.
C. Van Veen, “Making the Right Packaging Connections with Backplane Interconnections,” Electronic Packaging & Production, Newton, MA, May 1991., pp. 76-79.
“AMP Product Guide”, AMP Inc., 1991, pp. 3008, 3067, 3068, 3102, 3103 and 3123.
R.R. Tummala et al., “Microelectronics Packaging Handbook,” Van Nostrand Reinhold, 1989, pp. 38-43, 398,403, 779-791, 853-859, and 900-905.
“Packing,” Intel Corporation, 1993, pp. 2-36, 2-96, 2-97, 2-100, 3-2, 3-24, and 3-25.
George D. Gregoire, “3-Dimensional Circuitry Solves fine Pitch SMT Device Assembly Problem,” Connection Technology.
Dimensional Circuits Corporation, “Dimensional Circuits Corp. Awarded Two U.S. Patents,” D.D.C. News, Apr. 5, 1994.
George D. Gregoire, “Very Fine Line Recessed Circuitry—A New PCB Fabrication Process”.
“AMP-ASC Interconnection Systems,” AMP Incorporated, Product Information Bulletin, pp. 1-4, copyright 1991.
Barnhouse, “Bifurcated Through-Hole Technology—An Innovative Solution to Circuit Density”, Connection Technology, pp. 33-35, Feb. 1992.
“Micro-Strip Interconnection System,” AMP Product Guide, pp. 3413-3414, Jun., 1991.
“Rib-Cage II Through-Mount Shrouded Headers” and “Micropax Board-to-Board Interconnect System,” Du Pont Connector Systems Product Catalog A, pp. 2-6, 3-0, 3-1, Feb., 1992.
“82430 PCIset Cache/Memory Subsystem,” Intel Corporation, pp. 1-888, Mar. 1993.
“The PCI Revision 1.0 Specification,” published by Intel Corporation, specifically Chapter 4.42 “Systems Parameters,” Jun. 22, 1992.
“82420/82430 PCIset ISA and EISA Bridges,” Intel Corporation, pp. 1-350, Dec. 1993.
“R4000 Microprocessor User's Manual” with inserts by Toshiba.
“Pentium Processor User's Manual,” Intel corporation, vol. 1-3, 1993.
“Short Form Catalog,” 82C711 Data Book, Chips and Technologies, Inc., Fall, 1992.
M. E. St. Lawrence et al., “A High Density Land Grid Array Connector for MCM's,”Proceedings of the Technical Program, National Electronic Packaging and Production Conference,Feb. 24-28, 1991, Anaheim, CA, pp. 1491-1511.
M. G. Freedman, “MCMs Interconnection Options,&#

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