Backplane fabrication method

Details Backplane fabrication method Backplane fabrication method

1982-01-13

1984-05-22

Weston, Caleb

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

29825, 29829, 29830, 156267, 156268, 174 685, B32B 3118, H05K 104

Patent

active

044500297

ABSTRACT:
A backplane power distribution system characterized by generally uniform current densities so as to be capable of handling very high levels of current. This is achieved with a stepped backplane construction. For example, in a system having, in order, a first conductive layer, a first dielectric layer, a second conductive layer, and a second dielectric layer, the second conductive and dielectric layers extend transversely beyond the first conductive and dielectric layers to present a substantial exposed area of the second conductive layer. Typically, a rectangular metal bus bar is bolted to the backplane to make contact with the exposed area, and power supply connections to the bus bar are made in any convenient manner. The backplane is preferably first laminated with all layers coextensive, and portions of the first conductive and dielectric layers then removed by milling.

REFERENCES:
patent: 3331718 (1967-07-01), Ruffing
patent: 3499218 (1970-03-01), Dahlgren et al.
patent: 3718936 (1973-02-01), Rice
patent: 3777221 (1973-12-01), Tatusko et al.
patent: 3909327 (1975-09-01), Pechini
patent: 4091125 (1978-05-01), Delgadillo
patent: 4250616 (1981-02-01), Klimek et al.

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