Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
1999-08-12
2001-05-29
Paladini, Albert W. (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S788000, C361S796000, C361S689000, C439S061000, C439S059000, C439S062000, C174S261000, C174S15800R
Reexamination Certificate
active
06239984
ABSTRACT:
FIELD OF THE INVENTION
This invention relates generally to the field of electronic chassis that house electronic components for high-speed telecommunication and networking applications and, in particular, to a backplane circuit board for an electronic chassis.
BACKGROUND OF THE INVENTION
An electronic chassis which houses electronic components for high speed telecommunication and networking applications typically includes a plurality of vertically oriented circuit board assemblies, each of which are typically comprised of a circuit board attached to a U-shaped bracket member. These circuit boards are typically referred to as application cards. The application cards are inserted into the chassis and are guided into the chassis along a pair of card guide assemblies mounted between the side walls of the chassis. One of the card guide assemblies is typically located adjacent the top of the chassis and the other is typically located adjacent the bottom of the chassis.
A backplane circuit board having various surface mounted connectors is typically fastened to the pair of card guide assemblies and forms the back wall of the chassis. When fully inserted into the chassis, connectors located along the back edge of the application cards are connected to the connectors located on the backplane circuit board.
Conventional backplane circuit boards are typically comprised of a single circuit board. The top section of conventional backplane circuit boards typically includes a plurality of surface mounted connectors that provide electrical connections between the various application cards within the chassis. These connectors are not double-sided and therefore do not extend through the circuit board to the backside of the circuit board. The bottom section of conventional backplane circuit boards typically includes a plurality of telephone connectors have double sided telephone connectors that have an input on one side of the circuit board and output on the other. Input cables from outside of the chassis are connected to the telephone connectors on the backside of the circuit board.
There are several disadvantages to this arrangement. Conventional backplanes have to be moved away from the back portion of the chassis, toward the front of the chassis, in order to accommodate the double-sided telephone connectors that project outward on both sides of the backplane circuit board. This takes up a considerable amount of space within the chassis, which has strict dimensional requirements. For example, conventional electronic chassis must typically maintain a depth of 11.811 inches.
The placement of conventional backplanes also has a negative impact of the application cards within the chassis. For example, the placement of a conventional backplane typically limits the size of the application cards located within the chassis. This in turn limits the amount of space available on the applications cards for various electronic functions.
Accordingly, it would be desirable to have a backplane circuit board that overcomes the disadvantages described above.
SUMMARY OF THE INVENTION
One aspect of the invention provides a backplane circuit board for an electronic chassis including bracket and an upper circuit board operatively connected to the bracket. A lower circuit board is operatively connected to the bracket wherein the upper circuit board is offset from the lower circuit board and the upper circuit board is parallel to the lower circuit board. The bracket may preferably include a body portion, a first flange portion, and a second flange portion. The upper circuit board may preferably be operatively attached to the first flange portion and the lower circuit board may be attached to the second flange portion. The first flange portion may preferably include a plurality of openings to allow the upper circuit board to be attached to the first flange portion. Similarly, the second flange portion may preferably include a plurality of openings to allow the lower circuit board to be attached to the second flange portion. The upper circuit board may preferably be substantially parallel to lower circuit board. The bracket may preferably include a first end and a second end. A first plate member may preferably be positioned at the first end of the bracket and a second plate member may preferably be positioned at the second end of the bracket. The first and second plate members may preferably each include at least one opening to allow the first and second plate members to be fastened to the electronic chassis. The upper circuit board may preferably include a plurality of openings to allow the upper circuit board to be fastened to the electronic chassis. The lower circuit board may preferably include a plurality of openings to allow the lower circuit board to be fastened to the electronic chassis. A plurality of telephone connectors may preferably be mounted to the lower circuit board and a plurality of connectors may preferably be mounted to the upper circuit board.
Another aspect of the invention provides a backplane circuit board for an electronic chassis including a bracket mounted to the electronic chassis. An upper circuit board is mounted to the electronic chassis and is operatively connected to the bracket. A lower circuit board is mounted to the electronic chassis and is operatively connected to the bracket wherein the upper circuit board is offset from the lower circuit board and the upper circuit board is parallel to the lower circuit board.
Another aspect of the invention provides a method of assembling a backplane circuit board. A bracket, an upper circuit board operatively connected to the bracket, and a lower circuit board operatively connected to the bracket is provided. The upper circuit board is offset from the lower circuit board, and the upper circuit board is positioned in parallel to the lower circuit board.
The invention provides the foregoing and other features, and the advantages of the invention will become further apparent from the following detailed description of the presently preferred embodiments, read in conjunction with the accompanying drawings. The detailed description and drawings are merely illustrative of the invention and do not limit the scope of the invention, which is defined by the appended claims and equivalents thereof.
REFERENCES:
patent: 4498717 (1985-02-01), Reimer
patent: 5023754 (1991-06-01), Aug et al.
patent: 5065141 (1991-11-01), Whitsitt
patent: 5173845 (1992-12-01), Shaw
patent: 5289340 (1994-02-01), Yoshifuji
patent: 5398161 (1995-03-01), Roy
patent: 6131274 (2000-10-01), Koradis et al.
patent: 6175507 (2001-01-01), Koradis et al.
Greco Gerald A.
Koradia Amir
Pogatetz Douglas J.
Ravlin Philip A.
3Com Corporation
Baniak Pine & Gannon
Foster David
Paladini Albert W.
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