Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With mating connector which receives panel circuit edge
Reexamination Certificate
1997-12-17
2001-06-05
Abrams, Neil (Department: 2839)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With mating connector which receives panel circuit edge
C361S788000
Reexamination Certificate
active
06241530
ABSTRACT:
BACKGROUND OF THE INVENTION
This invention relates to electronic systems. In particular, the present invention is a backplane assembly for an electronic system chassis, wherein the backplane assembly incorporates connectors for a variety of printed circuit board modules in a multiple channel architecture.
The general construction and operation of electronic systems for an electronic device necessitates that a plurality of printed circuit board modules, such as input/output (I/O) modules be electronically connected to one or more central processing units. In order to achieve this electronic connection, each I/O module electronically contacts a mother board, often referred to as a backplane board as it is vertically mounted as a back wall of an electronic system chassis. The backplane includes a plurality of connectors for releasably interconnecting with a mating connector along a rear edge of each of the I/O modules. Typically, a pair of opposed side walls of the chassis incorporate guide channels for providing lateral support to the I/O modules when interconnected with the backplane.
For fail/safe operation, as may be necessary in electronic devices of aircraft systems, construction of the electronic system necessitates the use of redundant I/O modules. Typically, to achieve such redundancy requires the use of two chassis, with each chassis having an identical set of I/O modules. Each backplane of the redundant chassis would be linked to the electronic device through its own signal transmitting bus or channel. In other words, I/O modules of one chassis would be linked to the electronic device through a so called “channel A”, while the redundant, second chassis would be linked to the electronic device through a so called “channel B”. Operational failure of an I/O module within the one chassis would only require switching from the inoperative channel A to the operative channel B of the operational redundant, second chassis, to maintain the operation of the electronic device. One drawback of this redundant chassis architecture, particularly with regard to aircraft where space is at a premium, is the space requirement for the chassis of the redundant, second set of I/O modules.
U.S. Pat. No. 5,547,386 to Fredberg in one way, addresses this redundant chassis, space requirement drawback of redundant channel electronic systems. In Fredberg, a single chassis, having a single backplane incorporating redundant sets of connectors is used. The backplane connectors for the I/O modules are arranged side by side, with adjacent backplane connectors alternating between channel A and a channel B. Though the backplane architecture of Fredberg eliminates the added bulk of the redundant, second chassis, there are some disadvantages to the Fredberg design. For example, since only a single backplane is used, it is difficult to discern which I/O modules are on channel A and which are on channel B. This difficulty is particularly evident when inoperative or damaged I/O modules of an inoperative channel need to be identified for repair or replacement. In addition, due to the alternating nature of the channel A and channel B backplane connectors of Fredberg, I/O modules of a common channel can not be arranged side by side. Moreover, the backplane scheme of Fredberg can not accommodate “ganging” (i.e., connecting multiple I/O modules directly together) of like I/O modules.
There is a need for improved redundant channel, backplane assemblies for chassis of electronic systems. In particular, there is a need for a redundant channel, backplane assembly wherein I/O modules on channel A can be quickly discerned from I/O modules on channel B. This would allow I/O modules of an inoperative channel (inoperative due to inoperative or damaged I/O modules) to be readily identified with respect to the operative I/O modules of the operative redundant channel. In addition, the redundant channel, backplane assembly should permit I/O modules of a common channel to be arranged side by side, and should accommodate ganging of like I/O modules. Lastly, the redundant channel, backplane assembly should be as compact as possible so as to be particularly suitable for use in aircraft or wherever space is at a premium.
SUMMARY OF THE INVENTION
The present invention is a backplane assembly for printed circuit board modules. The backplane assembly includes a backplane having first and second signal transmission channels. Multiple pairs of substantially identical first and second connectors are mounted on the backplane. The first connector of each of the multiple pairs is connected to the first signal transmission channel. The second connector of each of the multiple pairs is connected to the second signal transmission channel. The first and second connectors of the multiple pairs each have a long dimension and a short dimension, and are positioned on the backplane with the first connector above the second connector and with the short dimensions of the first and second connectors being most proximate.
Modules connected to the second connectors of the second channel are oriented substantially 180° opposite to the modules connected to the first connectors of the first channel. This allows modules on the first channel to be quickly discerned from the modules of the second channel. Therefore modules of an inoperative channel (inoperative due to inoperative or damaged modules) can be readily identified with respect to the operative modules of the operative channel, so that the inoperative modules can be repaired or replaced. This backplane assembly permits modules of a common channel to be arranged side by side, and accommodates ganging of like modules. In addition, this backplane assembly is compact so as to be particularly suitable wherever space is at a premium, such as in aircraft.
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patent: 5547386 (1996-08-01), Fredberg
patent: 5603044 (1997-02-01), Annapareddy et al.
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Eddy Brett A.
Glithero Jason L.
Abrams Neil
Honeywell Inc.
Hyeon Hae Moon
Snell & Wilmer
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