Backpanel having multiple logic family signal layers

Details Backpanel having multiple logic family signal layers Backpanel having multiple logic family signal layers

1989-08-23

1991-10-29

Nimmo, Morris H.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174261, 174264, 361414, H05K 100

Patent

active

050618245

ABSTRACT:
A printed circuit board backpanel uses stripline construction to allow emitter coupled logic. (ECL) signals and transistor-transistor logic (TTL) signals on the same signal layer, while providing electromagnetic interference (EMI) emission control.

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