Backlight module and light emitting diode package structure...

Details Backlight module and light emitting diode package structure... Backlight module and light emitting diode package structure...

2007-10-10

2010-02-16

Monbleau, Davienne (Department: 2893)

Active solid-state devices (e.g., transistors, solid-state diode

Incoherent light emitter structure

With housing or contact structure

C257S098000, C257SE33001, C257S433000, C257S678000, C362S097100, C362S600000, C362S612000, C362S613000, C362S341000, C349S061000

Reexamination Certificate

active

07663154

ABSTRACT:
A LED package structure including a carrier, LED chips, and a package body is provided. The carrier defines a cave with two opposite first side walls, two opposite second side walls and a rectangular bottom surface. An included angle between the first side wall and the bottom surface differs from that between the second side wall and the bottom surface. The LED chips are disposed in a straight-line arrangement on a center line of the bottom surface and electrically connected to the carrier. The center line is parallel to a long side of the bottom surface. The package body is formed on the carrier to cover the LED chips. Since the included angle between the first side wall and the bottom surface differs from that between the second side wall and the bottom surface, light provided by the LED package structure has different spatial radiation patterns in different directions.

REFERENCES:
patent: 6642547 (2003-11-01), Matsubara et al.
patent: 2006/0279216 (2006-12-01), Kim et al.
patent: 2007/0109779 (2007-05-01), Sekiguchi et al.
patent: 2008/0173883 (2008-07-01), Hussell et al.
patent: I237406 (2005-08-01), None

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