Backlight module and heat dissipation structure thereof

Details Backlight module and heat dissipation structure thereof Backlight module and heat dissipation structure thereof

2005-11-22

2005-11-22

Sember, Thomas M. (Department: 2875)

Illumination

Light source and modifier

With ventilating, cooling or heat insulating means

C362S373000

Reexamination Certificate

active

06966674

ABSTRACT:
A backlight module and heat dissipation structure thereof. The heat dissipation structure is used for a backlight module which comprises a circuit board having a through hole with a light emitting diode (LED) corresponding thereto and disposed on one side of the circuit board. The heat dissipation structure comprises a heat conducting portion thermo-conductively connected to the LED and positioned in the through hole, a thermal conductive element disposed between the heat conducting portion and the LED, and a heat dissipating portion thermo-conductively connected to the heat conducting portion. Heat from the LED is conducted through the thermal conductive element and the heat conducting portion to the heat dissipation portion.

REFERENCES:
patent: 5782555 (1998-07-01), Hochstein
patent: 5785418 (1998-07-01), Hochstein
patent: 5857767 (1999-01-01), Hochstein
patent: 6582100 (2003-06-01), Hochstein et al.
patent: 6787999 (2004-09-01), Stimac et al.
patent: 2004/0264195 (2004-12-01), Chang et al.

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