Backlight module and a light-emitting-diode package...

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – Encapsulated

Reexamination Certificate

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Details

C257S098000, C257S099000, C257SE33059, C257SE33058

Reexamination Certificate

active

07339202

ABSTRACT:
The LED package structure includes a substrate, an LED chip, a plastic package body, and two leading legs. In addition, the LED chip is arranged on the substrate and covered by the packaging plastic body. Moreover, the plastic package body contains a light-converging part and a light-scattering part, in which the light-converging part has a first axis and the light-scattering part has a second axis. In addition, the first axis of the light-converging part intersects the second axis of the light-scattering part. Furthermore, one terminal of each of the two leading legs is electrically connected to the LED chip while another terminal extends out of the packaging plastic body. Because the LED package structure can converge light and scatter light in different directions, the backlight module implementing the LED package structure has the advantage of a shorter light-mixing distance and better light utilization.

REFERENCES:
patent: 6679621 (2004-01-01), West et al.
patent: 6972439 (2005-12-01), Kim et al.
patent: 2004/0207999 (2004-10-01), Suehiro et al.
patent: 2005/0168987 (2005-08-01), Tamaoki et al.
patent: 2005/0225988 (2005-10-01), Chaves et al.
patent: 2005/0265046 (2005-12-01), Liu
patent: 2005/0285133 (2005-12-01), Hung

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