Backing, transducer array and method for thermal survival

Details Backing, transducer array and method for thermal survival Backing, transducer array and method for thermal survival

2008-04-15

2008-04-15

Dougherty, Thomas M. (Department: 2834)

Electrical generator or motor structure

Non-dynamoelectric

Piezoelectric elements and devices

C310S322000, C310S326000, C310S334000

Reexamination Certificate

active

10921565

ABSTRACT:
Backing blocks, transducer arrays and methods are provided for thermal cycle survivability. By decoupling a portion of the backing block from a case used to contain the transducer stack, the greater thermal expansion properties of most backing blocks may be minimized. For example, a rim is formed on the backing block material. The rim is bonded to the case structure while other portions of the backing block remain free of bonding to the case structure. During thermal cycling or other temperature changes, the backing block may be less likely to expand or bulge and crack, delaminate or damage transducer elements or other transducer materials.

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