Backing plate for gate arrays or the like carries auxiliary comp

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

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Details

324755, 324765, 361767, 361790, H05K 111, H05K 114, G01R 3104

Patent

active

059402784

ABSTRACT:
A VLSI IC's signals as they appear at the signal via pads on the back side of a mother board may be probed with the aid of a backing plate that is a piece of multi-layer printed circuit board material thick enough to be sufficiently stiff for the purpose. The multi-layer PCB backing plate has front side pads and vias in at least those locations in the LGA (of signal via pads) corresponding physically to signals that are of interest for probing, and if such a subset is unknown ahead of time, the entire LGA of signal vias pads may be represented in the vias. An LGA socket connects the front side vias of the backing plate to the LGA of signal vias on the back side of the mother board carrying the gate array or other IC. Thus, those signals that, in the absence of a backing plate, could be probed on the back side of the mother board can now still be probed at back side pads on the back side of the PCB backing plate, just as if that were the back side of the mother board. The PCB backing plate allows the addition of power supply by-pass filtering without changing the layout of the mother board. Selected pins in the LGA may be connected to individual traces on interior planes of the PCB backing plate, or to entire conductive planes rather than mere traces. These traces or planes may then be used to make connections to by-pass capacitors located in out of the way locations, say, around the periphery of the PCB backing plate. Alternatively, the PCB backing plate may be used to simply make available additional mounting area for other original components generally.

REFERENCES:
patent: 4882657 (1989-11-01), Braun
patent: 5434513 (1995-07-01), Fujii et al.
patent: 5477160 (1995-12-01), Love
patent: 5534784 (1996-07-01), Lum et al.

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