Back side damage monitoring system

Optics: measuring and testing – Inspection of flaws or impurities – Transparent or translucent material

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

356237, G01N 2100

Patent

active

057643539

ABSTRACT:
A method of measuring and monitoring the back side and interior defect density of a wafer from its back side by substantially increasing the back side reflectivity through lapping, etching and controlled back side damage, then measuring defect density with an optical scanner.

REFERENCES:
patent: 4053335 (1977-10-01), Hu
patent: 4141780 (1979-02-01), Kleinknecht et al.
patent: 4410395 (1983-10-01), Weaver et al.
patent: 4547073 (1985-10-01), Kugimiya
patent: 5066359 (1991-11-01), Chiou
patent: 5196716 (1993-03-01), Moriya et al.
Operating Manual, High Yield Technology Inc., Optical Precipitate Profiler, Division of Pacific Scientific Company, Rev. Mar., 1994, pp. 1-1 through 1-6 cover sheet.
Semiconductor Materials & Process Technology Handbook for VLSI & ULSI, Edited by Gary E. McGuire, Noyes Publications, Copyright 1988, pp. v through xiii and two cover sheets.
Silicon Processing, D.C. Gupta, Editor, ASTM STP 804, A symposium sponsored by ASTM Committee F-1 on Electronics, National Bureau of Standards, and Stanford University, San Jose, CA., 19-22 Jan. 1982, Printed in Baltimore, Md (b) Jun. 1983, pp. 5 through 23 with three cover sheets.
Preparation of Samples for Microscopic Examination #7 and Microscopy & Photocopy #8 Chapter #7 was coauthored by Stacy B. Watelski, at least as early Jan. 1, 1996, 187 through 241.
Semiconductor Measurements and Instrumentation, W.R. Runyan, Special Circuits Department, Texas Instruments Incorporated, McGraw-Hill Book Company, Copyright 1975 Editors for this book were Tyler G. Hicks, Lester Strong, & the production supervisor George Dechsner, pp. 21 through 63 with three cover sheets.
Vol. 36, Impurity Diffusion & Gettering in Silicon, Editors Richard B. Fair, Charles W. Pearce, Jack Washburn Symposium held Nov. 27-30, 1984, Boston, Mass. Copyright 1985 by Materials Research Society pp. vii, no number page, 160-174, and two cover sheets.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Back side damage monitoring system does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Back side damage monitoring system, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Back side damage monitoring system will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2207073

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.