Back side component placement and bonding

Details Back side component placement and bonding Back side component placement and bonding

2007-02-13

2007-02-13

Nguyen, Ha Tran (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

Reexamination Certificate

active

11360248

ABSTRACT:
Where double sided circuit boards are utilized, having components on both sides, cooling is easily achieved by utilizing an appropriate thermal bonding agent which is both thermally conductive and electrically insulating. The thermal bonding agent is coupled to the circuit board in a manner which surrounds and encapsulates components on one side of the circuit board. Attached to the other side of the thermal bonding material is a heat sink, or other heat management device. By using this configuration, heat is easily transmitted from the electrical components to the heat sink, while not creating any electrical interference or shorts for circuit components in contact with the thermal bonding material.

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