Back sealing of silicon wafers

Fishing – trapping – and vermin destroying

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

148DIG7, 148DIG15, 148DIG60, 437241, H01L 21318

Patent

active

046876820

ABSTRACT:
Sealing the backside of a semiconductor wafer prevents evaporation of the dopant (typically boron) when an epitaxial layer is grown on the front (active) side, thereby preventing autodoping of the epitaxial layer with excess dopant. The present technique deposits an oxide layer during the ramp-up of the furnace that also deposits the nitride cap, thereby avoiding an extra process step. It also avoids the higher temperatures required for the prior-art technique of growing the oxide layer, resulting in lower oxygen precipitation due to the capping process and a greater yield of usable wafers.

REFERENCES:
patent: 3556841 (1971-01-01), Iwasa
patent: 3660180 (1972-05-01), Wajda
patent: 3663319 (1972-05-01), Rose
patent: 3669769 (1972-06-01), Badami et al.
patent: 3716422 (1973-02-01), Ing et al.
patent: 3765960 (1973-10-01), Boss et al.
patent: 3769104 (1973-10-01), Ono et al.
patent: 3934060 (1976-01-01), Burt
patent: 4438157 (1984-03-01), Romano-Moran
Bratter et al., "Dielectric Structure as an Out-Diffusion Barrier" IBM TDB ol.-No. 6, Nov. 1970, p. 1422.
Annual Review of Materials Science, vol. 12, 1982, Robert A. Huggins, Editor-"Low Pressure Chemical Vapor Vapor Deposition"-S. D. Hersee and J. P. Duchemin, pp. 65 through 80.
Journal of Crystal Growth 70(1984) pp. 602 through 608, "The Role of Oxygen in Silicon for VLSI", K. Benzon & W. Lin.
Journal of Crystal Growth 70(1984), pp. 230 through 252, "Reduced Pressure Silicon Epitaxy: A Review"-C. W. Cullen & J. F. Corboy.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Back sealing of silicon wafers does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Back sealing of silicon wafers, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Back sealing of silicon wafers will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1117357

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.