Back-end metallisation process

Details Back-end metallisation process Back-end metallisation process

2005-01-11

2005-01-11

Wong, Edna (Department: 1753)

Coating processes

Electrical product produced

C427S097100, C427S299000, C427S301000, C205S115000, C205S118000, C205S123000, C205S125000, C205S210000

Reexamination Certificate

active

06841189

ABSTRACT:
The invention provides for a back-end metallisation process in which a recess is filled with copper and which includes the step of forming a plating base on the surfaces of the recess for the subsequent galvanic deposition of the said copper, and wherein subsequent to the formation of the plating base, but prior to the galvanic deposition of the copper, a modifying agent is introduced to the recess and which serves to absorb in the surface regions not covered by the plating base and to thereby modify the surface to promote copper growth thereon so as to effectively repair the initial plating base before the copper plating fill commences.

REFERENCES:
patent: 4751106 (1988-06-01), Wilkinson et al.
patent: 4948707 (1990-08-01), Johnson et al.
patent: 5576052 (1996-11-01), Arledge et al.
patent: 5866237 (1999-02-01), Angelopoulos et al.
patent: 6077780 (2000-06-01), Dubin
patent: 6565729 (2003-05-01), Chen et al.
patent: 6660154 (2003-12-01), Merricks et al.
patent: WO9947731 (1999-09-01), None

Affiliated with

Also associated with

Rating

Back-end metallisation process does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Back-end metallisation process, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Back-end metallisation process will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3393682