Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate
2005-08-09
2005-08-09
Graybill, David E. (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
C257S738000, C257S773000, C257S786000
Reexamination Certificate
active
06927491
ABSTRACT:
A back electrode type electronic part includes a main body including a circuit, and electrodes arranged for solder bumps on a back surface portion of the electronic part and connected to the circuit. Each of groups of the electrodes in portions of the electrode arrangement is provided for a single first solder bump which is larger than second solder bumps for the electrodes arranged other than the corner portions. Also, the group of electrodes includes electrodes having a substantially same potential level when the circuit operates.
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