B-stageable die attach adhesives

Details B-stageable die attach adhesives B-stageable die attach adhesives

2007-02-13

2007-02-13

Lebentritt, Michael (Department: 2812)

Semiconductor device manufacturing: process

With measuring or testing

Packaging or treatment of packaged semiconductor

C427S582000, C257S787000, C257S788000

Reexamination Certificate

active

10459601

ABSTRACT:
The present invention relates to b-stageable die attach adhesives, methods of preparing such adhesives, methods of applying such adhesives to the die and other substrate surfaces, and assemblies prepared therewith for connecting microelectronic circuitry.

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