Auxiliary cooling methods and systems for electrical device...

Details Auxiliary cooling methods and systems for electrical device... Auxiliary cooling methods and systems for electrical device...

2007-09-18

2007-09-18

Duong, Hung Van (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S695000, C710S002000, C257S715000

Reexamination Certificate

active

11280366

ABSTRACT:
Methods and systems for auxiliary cooling of electrical device housings are provided. In one embodiment, an electronics device enclosure system is provided. The system comprises a housing, wherein the housing encloses one or more electronic devices; a backplane situated within the housing wherein at least one of the one or more electronic devices are coupled to the backplane; and an auxiliary cooling system coupled to the backplane and adapted to receive electrical power from one or more power sources, wherein the auxiliary cooling system comprises one or both of a thermoelectric cooling module and a fan, and wherein the auxiliary cooling system is adapted to increase the heat transfer from the one or more electronic devices to an environment external to the housing.

REFERENCES:
patent: 5680294 (1997-10-01), Stora et al.
patent: 6748458 (2004-06-01), Andrewartha et al.
patent: 2005/0162830 (2005-07-01), Wortman et al.
patent: 2006/0044756 (2006-03-01), Wong
patent: 2006/0092611 (2006-05-01), Beihoff et al.

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