Automotive electronics module

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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156 69, 156292, B29C 6506

Patent

active

058557075

ABSTRACT:
A hermetically sealed automotive module is disclosed wherein a cover of the module is sealed to a housing of the module by vibration welding. A weld contact surface is defined between the cover and housing of the module when the cover and housing undergo relative reciprocating motion under the application of a force. A method for hermetically sealing a module is also disclosed.

REFERENCES:
patent: 3062695 (1962-11-01), Hull
patent: 3899378 (1975-08-01), Wragg et al.
patent: 3909504 (1975-09-01), Browne
patent: 4239575 (1980-12-01), Leatherman
patent: 4377428 (1983-03-01), Toth
patent: 4546412 (1985-10-01), Nakazawa et al.
patent: 4668873 (1987-05-01), Ohba et al.
patent: 4766520 (1988-08-01), Huber et al.
patent: 4769745 (1988-09-01), Viernickel et al.
patent: 4784709 (1988-11-01), Unger et al.
patent: 4899257 (1990-02-01), Yamamoto
patent: 5064485 (1991-11-01), Smith et al.
patent: 5223672 (1993-06-01), Pinneo et al.
patent: 5264661 (1993-11-01), Luettgen
Ultrasonics, vol. 5, No. 17, Jan. 1967, Guild Ford, p. 17, "Ultrasonic Welding".

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