Automatically adjusting serial connections of thick and thin...

Details Automatically adjusting serial connections of thick and thin... Automatically adjusting serial connections of thick and thin...

2007-10-30

2007-10-30

Fourson, George (Department: 2823)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Responsive to electromagnetic radiation

C438S080000, C438S098000, C438S763000, C438S944000, C257S448000, C257S461000, C257SE31124, C257SE31131, C136S256000

Reexamination Certificate

active

10508195

ABSTRACT:
The invention relates to a method for the production of automatically adjusting serial connections of thick and/or thin layers. The method comprises the following process steps: applying electrically conductive strip conductors (20) to a substrate (10); applying a first main layer (30) at an angle a relative to the surface of the substrate; applying a second main layer which is made of granular-shaped particles (40) to the substrate (10); applying several layers in conjunction with material and process-dependent processing steps; applying a third main layer (70) at an angle β relative to the surface of the substrate; and applying a fourth main layer (80) at an angle y relative to the surface of the substrate.

REFERENCES:
patent: 6313905 (2001-11-01), Brugger et al.
patent: 6716656 (2004-04-01), Shtein et al.
patent: 2001/0032666 (2001-10-01), Jenson et al.
patent: 2003/0207505 (2003-11-01), Theiss et al.
patent: 2005/0000561 (2005-01-01), Baret et al.
patent: 37 27 825 (1989-03-01), None
patent: A O 853 345 (1998-07-01), None
patent: WO 96/30935 (1996-10-01), None

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