Automatic wiring machine for printed circuit boards

Metal fusion bonding – With means to juxtapose and bond plural workpieces – Wire lead bonder

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Details

29850, 228105, 228 8, H05K 1306

Patent

active

044376030

ABSTRACT:
A machine for automatically wiring an insulated fine wire as thin as a hair on the printed circuit board of wiring patterns are set up between adjacent conductor printed circuit board to be applied with wirings is carried by an X-Y table which is movable in X and Y directions, and the X-Y table is moved in accordance with wiring sites. A wire guide unit, a bonding unit and a wire cutter unit mounted, above the X-Y table, to a head rotatably supported about an axis perpendicular to the X-Y table surface are rotated along with the head so as to be oriented in various directions an optical device is supported for optical monitoring of the operations from above along the rotational axis of the bonding head. The wire guide unit sequentially pays out the insulated fine wire onto the printed circuit board carried by the X-Y table, the bonding unit exposes the core of the payed-out insulated wire and fuses the wire for connection thereof to the conductor pad of the printed circuit board by heating and depressing the payed-out wire, and the wire cutter unit cuts away the wire after completion of wiring.

REFERENCES:
patent: 3646307 (1972-02-01), Hazel
patent: 3960309 (1976-06-01), Hazel
patent: 4031612 (1977-06-01), Nicolas
patent: 4098447 (1978-07-01), Edson et al.
patent: 4239144 (1980-12-01), Elles et al.

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