Metal fusion bonding – With control means responsive to sensed condition – Work-responsive
Patent
1983-02-28
1986-12-30
Ramsey, Kenneth J.
Metal fusion bonding
With control means responsive to sensed condition
Work-responsive
219388, 219480, 228 37, 364477, B23K 304, H05K 334, H05B 716
Patent
active
046322914
ABSTRACT:
Automatic wave solder apparatus having a fluxer section, preheater section and wave soldering section through which circuit boards are passed by a conveyor. All of the major process parameters are monitored by a microprocessor. One specific parameter controlled is the temperature of the boards exiting from the preheater system. Preheating is carried out by two axially spaced banks of heaters, the upstream one supplying the major quantity of heat and the downstream one supplying sufficient heat to boost the temperature to the desired value. A pyrometer located in the zone between the two banks of heaters measures the heat radiated from the boards and this information is converted by the microprocessor to an appropriate instruction to the second bank of heaters. The soldering section has a solder pot assembly particularly adapted to the automatic nature of the apparatus. The pot can be jacked to the correct height according to the length of leads projecting from the boards under control of the microprocessor. Irrespective of the solder pot height the structure of the solder nozzle ensures constant values for the rear flowing portion of the wave. The pot may be swung out for cleaning.
REFERENCES:
patent: 4180199 (1979-12-01), O'Rourke et al.
patent: 4196839 (1980-04-01), Davis
patent: 4363434 (1982-12-01), Flury
patent: 4446358 (1984-05-01), Comerford et al.
Winther, "The New Solder Machine", Banner/Technical Devices Co., Inc., 1982.
Kostick et al, IBM Technical Disclosure Bulletin, vol. 22, No. 9, pp. 3984-3985, (Feb. 1980).
Buszard John F.
Down William H.
Drouin Marcel
Makhoul Elie
Rahn Armin
Electrovert Ltd.
Ramsey Kenneth J.
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