Automatic wafer position aligning method for wafer prober

Details Automatic wafer position aligning method for wafer prober Automatic wafer position aligning method for wafer prober

1989-02-27

1990-07-24

Karlsen, Ernest F.

Electricity: measuring and testing

Measuring, testing, or sensing electricity, per se

With rotor

324158P, 358101, G01R 3102, H04N 718

Patent

active

049437674

ABSTRACT:
An automatic alignment method of the position of the probe tips and electric pads of wafer comprises the steps of recognizing and filing the position data of the pads of a new sort wafer and correction amount data between the position of the electrode pads and the probe tips equipped actually with the probe, determining and filing not less than 2 positions of electrode pads for an .theta. alignment of probe, detecting and outputting a height level data of a position of a dummy wafer, forming probe mark, detecting and outputting the positions, in X-, Y-axes, and .theta. direction offset between pads and tips, correcting these offset, repeated these check steps, saving final correction data, and using these data for aligning an actual wafer.

REFERENCES:
patent: 4677474 (1987-06-01), Sato et al.

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