Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – With work feeding or handling means
Patent
1988-05-27
1990-10-02
Wityshyn, Michael
Adhesive bonding and miscellaneous chemical manufacture
Surface bonding means and/or assembly means therefor
With work feeding or handling means
156499, 156562, 156567, 156572, 156578, B65H 504, B65H 518
Patent
active
049604856
ABSTRACT:
A wafer mounting device for automatically adhering wafers individually on a polishing plate surface for polishing the surface of the wafers. The wafers are stacked in a wafer cassette and are taken out from the wafer cassette one-by-one, and transferred to an adhesive coating section of the device by a wafer carrying means. The surface of each of the wafers is coated with an adhesive wax in a coating section. Afterward the adhesive coated wafers are carried out from the coating section by the carrying means. The wafers are taken out from the carrying means and the surfaces thereof are reversed by a reverse chuck means. The polishing plate is disposed in a position automatically where the reversed wafers arrive, and the wafers are automatically adhered onto the surface of the polishing plate.
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Ichinose Yusaku
Imamura Hitoshi
Burns Robert E.
Enya Mfg. Co., Ltd.
Lobato Emmanuel J.
Wityshyn Michael
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