Automatic wafer lapping apparatus

Abrasive tool making process – material – or composition – With carbohydrate or reaction product thereof

Patent

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Details

51215M, 51215UE, 414217, 414416, 414222, B24B 3704

Patent

active

051740672

ABSTRACT:
An automatic wafer lapping apparatus in which a pair of turntable stages are provided which each have a vertical central shaft and a pin on which the wafer carriers are spitted and piled up; furthermore, the teeth of the sun gear and the internal gear of the lapping assembly are bevelled at their upper portions in a manner such that the upper end of each tooth is tapered and converge into a linear ridge so as to facilitate automatic and prompt meshing of the carriers inbetween them.

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