Automatic wafer lapping apparatus

Details Automatic wafer lapping apparatus Automatic wafer lapping apparatus

1992-12-15

1994-08-02

Lavinder, Jack

Abrasive tool making process, material, or composition

With carbohydrate or reaction product thereof

51132, 51215CP, 51215UE, 511313, 51117, 51118, B24B 704, B24B 722

Patent

active

053334132

ABSTRACT:
An automatic wafer lapping apparatus including: a lapping assembly consisting of an upper lapping plate, a lower lapping plate and wafer carriers; a loader assembly installed in the vicinity of the lapping assembly; an unloader assembly installed in the vicinity of the lapping assembly; and a robot having wafer holder member for holding a plurality of wafers and for transferring the wafers between the loader assembly and the unloader assembly and the lapping assembly, WHEREIN the wafer lapping assembly further includes a position sensor for detecting the position of the carriers and a device for cleaning the wafer holder, and the robot consists of a single-handed arm and the wafer holder supported at the fore end of the arm of the robot which can hold wafers one by one.

REFERENCES:
patent: 4002246 (1977-01-01), Brandt et al.
patent: 4593495 (1986-06-01), Kawakami et al.
patent: 4856232 (1989-08-01), Shirai
patent: 4916868 (1990-04-01), Wittstock
patent: 5174067 (1992-12-01), Hasegawa et al.

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