Automatic testing system and method for semiconductor devices

Details Automatic testing system and method for semiconductor devices Automatic testing system and method for semiconductor devices

1996-07-01

1998-08-04

Milef, Boris

Classifying, separating, and assorting solids

Sorting special items, and certain methods and apparatus for...

Condition responsive means controls separating means

3241581, B07C 5344

Patent

active

057880840

DESCRIPTION:

BRIEF SUMMARY
FIELD OF THE INVENTION

The present invention relates to a semiconductor device testing system comprising a semiconductor device testing apparatus (commonly referred to as IC tester) having incorporated therein a semiconductor transporting and handling or processing apparatus (commonly referred to as IC handler) for transporting semiconductor devices (typically ICs, i.e., semiconductor integrated circuits) for testing and sorting the tested semiconductor devices on the basis of the test results, and particularly to an automatic semiconductor device testing system and method for automatically transporting, testing and handling or processing semiconductor devices.


BACKGROUND OF THE RELATED ART

Many of semiconductor device testing apparatus (hereinafter referred to as IC tester) for determining the electrical characteristics of semiconductor devices by applying signals of a predetermined test pattern to devices to be tested, i.e., devices under test (commonly called DUT) have a semiconductor transporting and handling apparatus (hereinafter referred to as IC handler) integrally incorporated therein for transporting semiconductor devices for testing and sorting the tested semiconductor devices on the basis of the test results. The system comprising a combination of the IC tester and the IC handler of the type described above is herein termed "semiconductor device testing system".
An example of the prior art IC handler called "forced horizontal transporting system" is shown in the form of a flow chart in FIG. 1. The illustrated IC handler 10 comprises a loader section 11 where ICs 15 to be tested which a user has beforehand loaded on a customer (user) tray 13 are transferred and reloaded onto a test tray 14 capable of withstanding high/low temperatures, a constant temperature or thermostatic chamber 20 including a test section or testing zone 21 for receiving and testing the ICs from the loader section 11, and an unloader section 12 where the tested ICs 15 which have been carried on the test tray 14 out of the constant temperature chamber 20 subsequently to undergoing a test in the test section 21 are transferred from the test tray 14 to the customer tray 13 to be reloaded on the latter (generally, the tested ICs are often sorted by categories based on the data of the test results and transferred onto the corresponding customer trays.) Depending upon the type of ICs to be tested (in the case of the surface mount type ICs or the like each packaged in a dual-in-line flat package, for example), each IC may be loaded on an IC carrier, and then the IC carrier loaded with the IC may be placed on a customer tray.
The test tray 14 is moved in a circulating manner from and back to the loader section 11 sequentially through the constant temperature chamber 20 and the unloader section 12. More specifically, the test tray 14 loaded with ICs 15 to be tested is transported from the loader section 11 to a soak chamber 22 within the constant temperature chamber 20 where the ICs 15 placed on the tray 14 are heated or cooled to a predetermined constant temperature. Generally, the soak chamber 22 is adapted to store a plurality of (say, nine) test trays 14 stacked one on another such that a test tray 14 newly received from the loader section 11 is stored at the bottom of the stack while the uppermost test tray is delivered to the testing zone 21. The ICs 15 to be tested are heated or cooled to a predetermined constant temperature while the test tray 14 is moved from the bottom to the top of the stack within the soak chamber 22. The heated or cooled ICs 15 together with the test tray 14 are then transported while maintained at the constant temperature from the soak chamber 22 to the test section 21 where the ICs under test are brought into electrical contact with IC sockets (not shown) disposed in the test section 21 to be measured for their electric characteristics. Upon completion of the test, the tested ICs 15 are transported from the test section 21 to an exit chamber 23 where they are restored to the ambient temperature. Li

REFERENCES:
patent: 5307011 (1994-04-01), Tani

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