Automatic tape lay-up system

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

Patent

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Details

156256, 156264, 156265, 156267, 156350, 156517, 156522, 156523, 156538, 156539, 156540, 226 49, 226109, 226110, 226114, B32B 3104

Patent

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042857520

ABSTRACT:
An automatic tape laying system (10) for depositing tape (66) in a lay-up (36) on a work surface (14) is provided. The system (10) includes a tape deposit apparatus (26) including a tape supply reel (64) and a cutting device (94). A tape transport module (60) transports tape from the tape supply reel (64) to the cutting device (94). A tape deposit module (62) is provided within tape deposit apparatus (26) and is rotatable between first and second positions for receiving tape (66) from the tape transport module (60). Tape 66 is received in a port (134) of tape deposit module (62) for deposit along a first direction on the work surface (14), and tape (66) is received in a port (148) for deposit along a second direction on the work surface (14). Scrap tape (176) is received in a port (122) for removal.

REFERENCES:
patent: 2026402 (1935-12-01), Schlemmer
patent: 2746543 (1956-05-01), Gezich
patent: 3577297 (1971-05-01), Howard
patent: 3587378 (1971-06-01), Oppenheim et al.
patent: 4033214 (1977-07-01), Pearl
patent: 4047457 (1977-09-01), Stubbings

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