Automatic soldering method and the apparatus thereof

Details Automatic soldering method and the apparatus thereof Automatic soldering method and the apparatus thereof

1989-12-21

1991-06-18

Ramsey, Kenneth J.

Metal fusion bonding

Process

Plural joints

228 37, 228260, H05K 334

Patent

active

050243705

ABSTRACT:
An automatic soldering method and the apparatus thereof is disclosed, wherein a transporting device progressively moves up a horizontal position of a base board as the latter is transported to be soldered in a direction from a base board entrance side to a soldered base board exit side of a base board transporting path. An elongated molten solder storing tank is arranged laterally of the base board transporting path. The solder storing tank has an elongated molten solder jetting nozzle located therein and is inclined in a horizontal plane with respect to a base board transporting direction. An operating device is provided to adjust an inclination of the base board in a vertical plane intersecting the base board transporting direction such that a distance between a lower side of the base board and a top end of the molten solder jetting nozzle is constant all through the length of the nozzle as the base board is transported past over the nozzle.

REFERENCES:
patent: 4424931 (1984-01-01), Lovrenich

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