Automatic soldering mechanism capable of improving a working eff

Details Automatic soldering mechanism capable of improving a working eff Automatic soldering mechanism capable of improving a working eff

1998-10-30

2000-10-31

Ryan, Patrick

Metal fusion bonding

Including means to apply flux or filler to work or applicator

By partial or total immersion of work or applicator into liquid

228 35, 228 14, 228260, H05K 334

Patent

active

061388904

ABSTRACT:
An automatic soldering mechanism is for jetting a solder jet flow to a printed-circuit board to carry out a soldering of the printed-circuit board. The automatic soldering mechanism comprises a solder tank for storing a molten solder and a solder jetting nozzle section for jetting the solder jet flow higher than a melt surface of the molten solder within the solder tank in an inert gas atmosphere.

REFERENCES:
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patent: 4807794 (1989-02-01), Hess
patent: 4824010 (1989-04-01), Inoue et al.
patent: 5156324 (1992-10-01), Hueste et al.
patent: 5228614 (1993-07-01), Elliott et al.
patent: 5379931 (1995-01-01), Van Schaik
patent: 5397049 (1995-03-01), Gileta et al.
patent: 5411200 (1995-05-01), Conners et al.
patent: 5981922 (1999-11-01), Masuda et al.

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