Electric heating – Metal heating – For bonding with pressure
Patent
1985-11-13
1987-07-07
Broome, Harold
Electric heating
Metal heating
For bonding with pressure
219 85G, B23K 102, B23K 104
Patent
active
046788867
DESCRIPTION:
BRIEF SUMMARY
FIELD OF THE INVENTION
The present invention relates to an automatic soldering device which enables soldering work at a higher precision and efficiency.
BACKGROUND OF THE INVENTION
Soldering has conventionally been done manually in most of the cases because soldering conditions vary greatly in each case. A device which meets such diversified requirements would inevitably become complicated and large in size. Moreover, merits of automatized soldering device are not fully appreciated in certain areas. In such areas they manage to do soldering works manually.
On the other hand, it is quite difficult to obtain uniform soldering with excellent luster finish. Need for automatic soldering device which can replace the manual operations was mounting, particularly in industries relating to products of greater added value.
The present inventor developed an automatic soldering device which comprises a soldering iron which is moved vertically by an air cylinder, a separate solder feeding means to feed thread-like solder at timing aligned to said vertical movement in two steps, i.e. primary and secondary feedings in a given amount, under controlled preheating time and heating time.
The present invention aims to improve the automatic soldering device contrived by the present inventor and to achieve higher precision and efficiency in soldering operations.
DISCLOSURE OF THE INVENTION
In order to achieve the object of the present invention, a soldering iron is lowered toward the surface to be worked by means of an air cylinder. A given amount of thread solder is supplied from a solder feeder which is separately installed via a tube at timing aligned with the lowering of the soldering iron. Under controlled preheating and heating times for the solder iron, thread solder is supplied in two steps to the tip attached in advance to the lower end of the soldering iron.
The automatic soldering device of above construction is characterized in that the tip of the feeding tube for guiding the thread solder is directed toward the end of the iron tip and supported by a holder near the tip, the base of the holder is held by a base plate by means of a spring, the base plate being freely adjustable as to its lowering position relative to the iron tip, and the base plate can be freely adjusted in angles vertically, horizontally and obliquely with respect to the solder tip by the degree of projection of plural adjusting screws provided on the base plate.
According to the present invention, the best positions of the iron tip and the solder line can be aligned in optimum relation. Automatic soldering of high precision and efficiency becomes possible notwithstanding the wear of the iron tip.
In the automatic soldering device of the present invention, the tip of an air tube for injecting air is supported by said holder in the same manner as the feeding tube for feeding thread solder. Further, a sludge receiving port connected to a vacuum hose is opposed to the iron tip in a freely approachable manner.
According to the present invention, the soldering iron can be cleaned by blowing off sludge, etc. with air injected from the air tube which is opposed to the iron tip and by drawing it by suction into the sludge receiving port for removal.
Further in the present invention, the holder which supports each tip of the thread solder feeding tube and the air injection tube is positioned slightly below the end of the iron tip before the iron tip comes in contact with the work surface, so that when the tip touches the work surface, the solder thread can be supplied at the iron tip.
According to this invention, it becomes possible to prevent undesirable state on the surface which might otherwise be caused by the contact of thread solder with the surface at the secondary soldering stage.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 shows a schematic perspective view of the automatic soldering device according to the present invention.
FIG. 2 is a schematic front view to show connection of components shown in FIG. 1.
FIG. 3 is an enlarged perspective v
REFERENCES:
International Search Report, PCT/JP85/00083.
Broome Harold
Donovan Lincoln
Klauber Stefan J.
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