Metal fusion bonding – Process – With condition responsive – program – or timing control
Patent
1994-04-26
1996-08-06
Bradley, P. Austin
Metal fusion bonding
Process
With condition responsive, program, or timing control
228103, 228 7, 228 9, B23K 119
Patent
active
055426000
DESCRIPTION:
BRIEF SUMMARY
TECHNICAL FIELD
This invention relates to an automatic soldering apparatus for performing soldering automatically to effect electrical connections in order to mount electronic parts on a printed circuit board, an apparatus for a method of teaching soldering condition information, which is necessary for soldering, to the automatic soldering apparatus, a soldering inspection apparatus and method functioning to judge whether a soldered location is acceptable or not and generate information indicative of soldering correction conditions in order to correct a defective location in a case of a soldering defect, and an automatic soldering correction apparatus and method for automatically correcting a faulty soldered location.
BACKGROUND ART
Soldering apparatus presently available include a soldering apparatus that relies upon a flow soldering method in which a board on which electronic parts have been mounted in advance is dipped in a soldering bath to perform soldering, and a soldering apparatus that relies upon a reflow soldering method in which electronic parts are placed on a soldering cream that has been applied to part mounting positions on the surface of a board and the electronic parts are welded by application of heat.
However, each of these conventional soldering apparatus can be applied only to cases in which identical soldering conditions hold for all parts; they cannot be applied to cases where parts having markedly different thermal capacities or parts having a very small pitch between their leads are mounted on a board. These apparatus require that such parts be soldered individually manually or by robot.
The development of electronics manufacturing techniques has been accompanied by a diversification in the form of the electronic parts used. An increase in specially ordered parts and parts of a type different from the standard type has been accompanied by an increase in soldering locations that are unsuited to blanket soldering by soldering apparatus of the above-mentioned kind, and boards appear which require that all parts be soldered under individual conditions.
Practical application of an automatic soldering apparatus capable of performing soldering on a board automatically under soldering conditions that differ for each part is desired. In such an automatic soldering apparatus, it is required that the positions at which parts are to be soldered, the kinds of parts and the kinds of soldering conditions be instructed for each type of board before the soldering operation. The instructing operation is referred to as "teaching". The data taught includes information relating to part mounting positions on the board, types of parts to be mounted and soldering conditions necessary for automatic soldering.
In order to manually enter soldering conditions for each type of board and for each type of part, however, a great amount of time and labor is required and the automatic soldering apparatus cannot be operated during the teaching operation.
With regard to a printed circuit board on which many parts have been mounted by soldering, it is required that an inspection be performed after the soldering operation in order to determine whether soldering has been carried out appropriately. In order to meet this goal, automatic inspection apparatus that use image processing techniques to automatically inspect the quality of the soldered locations of each part on printed circuit boards having a large number of parts mounted thereon are being put into practical use. These automatic inspection apparatus detect the positions of faulty soldered locations on a printed circuit board as well as the types of faults and print out the results of detection on prescribed recording paper.
FIG. 30 illustrates a specific example of a recording paper 300 outputted by an automatic inspection apparatus. Numeral 301 denotes the outline of a printed circuit board, and number 302 designates the outline of a mounted part. Mounted parts at which faulty soldered locations do not exist are indicated in white on the inner side of the o
REFERENCES:
patent: 4667403 (1987-05-01), Edinger et al.
patent: 5094382 (1992-03-01), Shimizu
patent: 5197650 (1993-03-01), Monzen et al.
Supplementary European Search Report and Annex dated Mar. 9, 1995, and Communication mailed Mar. 23, 1995.
Kobayashi Shigeki
Yamamoto Norihito
Bradley P. Austin
Knapp Jeffrey T.
Omron Corporation
LandOfFree
Automatic soldering apparatus, apparatus and method for teaching does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Automatic soldering apparatus, apparatus and method for teaching, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Automatic soldering apparatus, apparatus and method for teaching will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2186169